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Current problemPre-bond surface readiness and release for hybrid bonding
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Pre-bond surface readiness and release for hybrid bonding

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3 priority paths16 candidate solutions15 sources

BLNKK's current understanding

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Structure / bonding interface
Unbonded Cu/dielectric surfaces
Observation stage
After CMP, cleaning and activation, before bonding
Phenomenon to localize
Surface topography, particles or chemical conditions outside the target process window
Engineering decision
Use traceable measurements of surfaces awaiting bonding to decide release, rework or hold and establish comparisons
Sample evidence still required
Who validates and approves the process’s release window and inspection coverage?
Next: confirm engineering conditionsUse 5 key conditions to adjust the assessment order, then choose solutions to compare.
Check engineering conditions →