Package solder-ball coplanarity and initial contact: How should the next comparison round be designed?

First correlate per-ball height datums, package / board support geometry, and initial placement contact.

Solder-ball coplanarityInitial contactBall-attachment height

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Which reference plane is used for per-ball heights, and how are missing balls / obscuration handled?
Is package / board geometry and support comparable at matching locations?
Is the anomaly an initial placement gap or lack of fusion after reflow?

Reference sourcesC2MI：KLA Tencor ICOS CI-T130S ↗

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Which reference plane is used for per-ball heights, and how are missing balls / obscuration handled?
Is package / board geometry and support comparable at matching locations?
Is the anomaly an initial placement gap or lack of fusion after reflow?

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Package solder-ball coplanarity and initial contact: How should the next comparison round be designed?

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