Your solution map
Package solder-ball coplanarity and initial contact
Check BLNKK's understanding of the problem, then review priority paths, candidate solutions and missing conditions.
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Your solution map
Check the problem definition, then choose which solutions to explore.
3 priority paths14 candidate solutions14 sources
BLNKK's current understanding
Please check the details- Structure / bonding interface
- Package solder-ball arrays and initial contact with the board
- Observation stage
- After ball attachment, before placement, and at initial contact
- Phenomenon to localize
- Ball-height distributions or local contact gaps
- Engineering decision
- Use ball heights and support geometry to plan comparisons of ball attachment, package flatness, or placement support.
- Sample evidence still required
- Which reference plane is used for per-ball heights, and how are missing balls / obscuration handled?
Paths to assess first
Paths serve different purposes and can be combined01
Per-ball height and coplanarity inspectionEstablish the height distribution after ball attachment
First02
Relative geometry and placement-contact comparisonsHold paste deposition / support constant when comparing initial gaps
First03
Ball-attachment and package-flatness comparisonsSeparate per-ball differences from package geometry
FirstCurrent candidate solutions
Sample suitability still needs confirmationEvaluation of ICOS BGA / LGA coplanarity inspectionC2MI · Can help answer: The institution's own equipment capabilities may be included in initial ball-height / coplanarity sampling requirements.
→Evaluation of DFP solder-ball heights and package geometryAkrometrix · Can help answer: Public DFP capabilities for discontinuous surfaces may be evaluated along height or geometry routes with complete inputs.
→Joint review of ball attachment, support, and placementBLNKK engineering review request (provider unconfirmed) · Can help answer: Determine variables for the next comparison round only when ball-height / geometry and placement inputs are both complete.
→Next: confirm engineering conditionsUse 4 key conditions to adjust the assessment order, then choose solutions to compare.
Check engineering conditions →