High initial RDL via contact resistance: How should the next round of comparisons be designed?

First confirm the initial electrical test, force / sense scope, and normal and anomalous vias that can be localized.

RDL viaInitial contact resistanceKelvin measurements

Problem context and interpretation

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What are the Kelvin / chain sense scope and normal controls?
Did the high reading occur initially or after thermal stress, and where is the targeted interface?
How are opening formation, wait time, pre-clean, and seed histories kept comparable?

Reference sourcesTektronix / Keithley：Two-Wire vs. Four-Wire Resistance Measurements ↗

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What are the Kelvin / chain sense scope and normal controls?
Did the high reading occur initially or after thermal stress, and where is the targeted interface?
How are opening formation, wait time, pre-clean, and seed histories kept comparable?

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High initial RDL via contact resistance: How should the next round of comparisons be designed?

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