Your solution map
High initial RDL via contact resistance
Check BLNKK's understanding of the problem, then review priority paths, candidate solutions and missing conditions.
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Your solution map
Check the problem definition, then choose which solutions to explore.
3 priority paths17 candidate solutions17 sources
BLNKK's current understanding
Please check the details- Structure / bonding interface
- RDL interlayer via bottoms and metal contacts
- Observation stage
- Initial electrical verification after RDL fabrication
- Phenomenon to localize
- High initial contact resistance or local discontinuity
- Engineering decision
- Use Kelvin / chain measurements and targeted interface localization to guide comparisons of via openings, cleaning, or seed coverage
- Sample evidence still required
- What are the Kelvin / chain sense scope and normal controls?
Paths to assess first
Paths serve different purposes and can be combined01
Kelvin / chain resistance decompositionFirst define which contact segment is being measured
First02
Localize openings and bottom contactsIdentify target interfaces using electrically characterized samples
First03
Interface-cleaning and seed comparisonsHold measurements and structures fixed when comparing contact formation
FirstCurrent candidate solutions
Sample suitability still needs confirmationAssess four-wire / Kelvin low-resistance measurementsTektronix / Keithley · Can help answer: Published wiring methods support reducing lead errors; the actual layout determines the range over which Rc can be distinguished.
→Assess targeted analysis of RDL via openings and bottomsASE · Can help answer: Published localization and cross-section capabilities can support samples with known initial anomalies.
→Joint review of measurements, interfaces, and PVD cleaningBLNKK engineering review request (provider unconfirmed) · Can help answer: Compare verifiable differences in openings, interface treatment, and seed only when inputs for all three routes are complete.
→Next: confirm engineering conditionsUse 4 key conditions to adjust the assessment order, then choose solutions to compare.
Check engineering conditions →