How should SiC ingot wire-slicing windows be compared for as-sliced thickness variation and damage?
This is an upstream SiC substrate-preparation problem. Measure as-sliced thickness and damage before comparing wire-slicing conditions and grinding allowance.
SiC ingot slicing thickness variation and damage
Problem context and interpretation
BLNKK review of public information
Use thickness maps and damage evidence to compare wire-slicing windows and downstream removal allowance
Record the ingot, slice order and material batch; use neighboring problems for backend die cutting.
Use actual process settings and equipment limits; advertised precision is not a batch result.
Use matched references and sampling for thickness/TTV; an intact surface does not exclude subsurface damage.
