Brittle fracture at solder IMC interfaces: How should the next round of comparisons be designed?

First retain both original fracture surfaces, and align phase and layer sequence with metallization, thermal, and loading histories.

IMC interface fractureMetallization layer sequenceFracture surfaces after aging

Problem context and interpretation

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Which layer contains the original crack, and could preparation shift the fracture surface?
How are actual phases and layer sequences identified, and what are the thickness distributions and resolution limits?
Which metallization, aging, and mechanical-mode inputs already have paired controls?

Reference sourcesASE：Failure Analysis Lab ↗

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Which layer contains the original crack, and could preparation shift the fracture surface?
How are actual phases and layer sequences identified, and what are the thickness distributions and resolution limits?
Which metallization, aging, and mechanical-mode inputs already have paired controls?

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Brittle fracture at solder IMC interfaces: How should the next round of comparisons be designed?

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