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Current problemBrittle fracture at solder IMC interfaces
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Brittle fracture at solder IMC interfaces

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3 priority paths14 candidate solutions15 sources

BLNKK's current understanding

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Structure / bonding interface
Solder intermetallic compounds and UBM / pad interfaces
Observation stage
Physical analysis after assembly, thermal aging, or mechanical loading
Phenomenon to localize
Brittle fracture surfaces along IMC / metal interfaces
Engineering decision
Use fracture location and metallization / aging history to guide interface-material and bonding-process comparisons
Sample evidence still required
Which layer contains the original crack, and could preparation shift the fracture surface?
Next: confirm engineering conditionsUse 5 key conditions to adjust the assessment order, then choose solutions to compare.
Check engineering conditions →