Internal voids in substrate microvia copper fill: How should the next comparison round be designed?

First establish pre-assembly via geometry, intravia defect locations, and panel / batch sampling maps.

Microvia copper fillIntravia voidsseam

Problem context and interpretation

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Is the void in the copper-fill body or at a Cu / Cu interface after thermal loading?
Are via geometry, panel locations, and normal / abnormal sampling representative?
How can comparable histories of pretreatment, waiting, CVS, current, and solution flow be preserved?

Reference sourcesASE：Failure Analysis Lab ↗

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Is the void in the copper-fill body or at a Cu / Cu interface after thermal loading?
Are via geometry, panel locations, and normal / abnormal sampling representative?
How can comparable histories of pretreatment, waiting, CVS, current, and solution flow be preserved?

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Internal voids in substrate microvia copper fill: How should the next comparison round be designed?

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