How can reflow testing reveal latent weak interfaces in stacked microvias that measure normally at room temperature?

IPC's original warning and method cover printed boards. Their use for organic-substrate microvias is an evaluation reference requiring separate scale, structure, and acceptance checks.

• Supplement room-temperature checks with dynamic electrical data.
• Map sampling to electrical anomaly locations.
• Record method revision and scope explicitly.

• How can reflow testing reveal latent weak interfaces in stacked microvias that measure normally at room temperature?
• Can the test provider explain adaptation limits and acceptance criteria when transferring PCB methods to package substrates?