Your solution map
Intermittent opens in stacked substrate microvias after reflow
Check BLNKK's understanding of the problem, then review priority paths, candidate solutions and missing conditions.
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Your solution map
Check the problem definition, then choose which solutions to explore.
2 priority paths7 candidate solutions7 sources
BLNKK's current understanding
Please check the details- Package architecture
- Organic package substrate / stacked microvias; material and dimensional differences from PCB unconfirmed
- Observation
- Intermittent continuity anomalies after reflow or at high temperature
- Evaluation stage
- Substrate acceptance, reflow, and rework preconditioning
- Variables to validate
- Microvia structure, target pads, Cu-fill interfaces, and thermal expansion
- Missing information
- Via-chain design, dynamic resistance, thermal history, cross-sections, and good batches
Paths to assess first
Paths serve different purposes and can be combined01
Reflow continuity and coupon designCapture anomalies hidden at room temperature
First02
Interface localization and process traceabilityConfirm anomaly locations and batch factors
FirstCurrent candidate solutions
Sample suitability still needs confirmationStandard test referenceIPC-TM-650 2.6.27B reflow thermal-stress methodIPC／Global Electronics Association · Can help answer: Do continuity anomalies occur during high-temperature reflow?
→Failure-localization workflowCorrelating dynamic resistance with target-interface cross-sectionsBLNKK editorial assessment workflow · Can help answer: Do electrical anomalies match microvia target interfaces?
→Adjacent use; applicability needs confirmationAMR conductor-resistance tracking during thermal cyclingESPEC · Can help answer: Post-reflow continuity problems require tracking conductor or joint resistance through thermal cycling.
→Next: confirm engineering conditionsUse 3 key conditions to adjust the assessment order, then choose solutions to compare.
Check engineering conditions →