Seams and voids in TSV copper fill: How should the next controlled comparison be designed?

First preserve upstream samples and establish depth-resolved morphology across multiple vias with shared film-deposition, bath-entry and plating histories.

TSV copper fillDeep-via seamsIntravia voids

Problem context and interpretation

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Are seams/voids inside the TSV copper before reveal?
Which via-bottom/sidewall seed and wetting regions have actual measurements?
Can bath analyses, electrical data and flow be aligned with defects under the same via geometry?

Reference sourcesASE：Failure Analysis Lab ↗

Technical Q&A awaiting input

Are seams/voids inside the TSV copper before reveal?
Which via-bottom/sidewall seed and wetting regions have actual measurements?
Can bath analyses, electrical data and flow be aligned with defects under the same via geometry?

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Seams and voids in TSV copper fill: How should the next controlled comparison be designed?

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