Your solution map
Seams and voids in TSV copper fill
Check BLNKK's understanding of the problem, then review priority paths, candidate solutions and missing conditions.
Your additions stay in this browserThis page contains curated public problem informationYour search text does not appear in URLs or server records
Your solution map
Check the problem definition, then choose which solutions to explore.
3 priority paths9 candidate solutions10 sources
BLNKK's current understanding
Please check the details- Structure / bonding interface
- Electroplated copper inside TSVs in silicon
- Observation stage
- Deep-via copper filling and before/after subsequent CMP
- Phenomenon to localize
- Seams or internal voids in TSV copper
- Engineering decision
- Use depth distributions and via-fill morphology to determine comparisons of plating mass transport, seed coverage or pretreatment
- Sample evidence still required
- Are seams/voids inside the TSV copper before reveal?
Paths to assess first
Paths serve different purposes and can be combined01
Depth distribution and targeted samplingConfirm the in-via locations of seams/voids
First02
Seed-coverage and wetting comparisonsSeparate plateable surfaces from their state before bath entry
First03
Plating mass-transport and via-fill-window comparisonsCompare bath/flow under known via geometry
FirstCurrent candidate solutions
Sample suitability still needs confirmationAssessment of depth-resolved TSV morphology samplingASE · Can help answer: Targeted FIB/cross-section capabilities can be arranged around representative via locations and depths.
→Assessment of Spherolyte Cu TSV AF via fillingMKS / Atotech · Can help answer: The publicly documented TSV electrolyte can be listed as a candidate for controlled bath/flow comparisons.
→Joint review of seed/wetting and mass transportBLNKK engineering review request (provider unconfirmed) · Can help answer: Compare depth-resolved defect responses to different variables only when controls for both stages are complete.
→Next: confirm engineering conditionsUse 5 key conditions to adjust the assessment order, then choose solutions to compare.
Check engineering conditions →