How do we check contact and thermal control when wafer probing shows false opens or temperature-dependent drift?

Check pad/bump geometry, probe contact, instrument calibration and actual temperature before targeted RDL or TSV fault analysis.

Wafer probing contact and thermal-control validity

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Compare contact baselines, probe force and actual temperature before separating test artifacts from device faults

Record total probe force, contact mode, pad/bump locations and marks; nominal compatibility does not establish valid contact.
Use golden, open/blank and repeated-contact controls; verify the installed low-current configuration.
Record settling time, self-heating, thermal contact and drift; chuck setpoint alone is not DUT-temperature evidence.

Reference sourcesFormFactor：Apollo vertical probe cards ↗

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How do we check contact and thermal control when wafer probing shows false opens or temperature-dependent drift?

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How do we check contact and thermal control when wafer probing shows false opens or temperature-dependent drift?

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