PS600S thermal warpage metrology system
Akrometrix · Warpage, topography and stress metrology
- Purpose
- Measures out-of-plane deformation through a complete heating and cooling profile, exposing warpage reversal, peak deformation and temperature-dependent behavior that room-temperature inspection can miss.
- Technical approach
- Shadow moire with automated phase stepping produces full-field height maps at each temperature point, creating a time-temperature history of deformation.
- Scope of use
- Can be used for reflow simulation, material or stack-up selection, process-window comparison and validation of finite-element models. The platform accepts samples up to 600 x 600 mm.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsSurface deformation does not establish internal failure causes or directly measure stress. Transparent or specular surfaces may need treatment, and sample properties affect achievable thermal ramps.
What to prepareBring sample dimensions, surface images, the target thermal profile and measurement regions. State the warpage acceptance criteria to discuss field of view, preparation and sampling.
Confirm with the supplierConfirm temperature tracking, resolution and repeatability on representative samples, including support and surface-treatment effects. For simulation validation, ask about export formats and coordinate definitions.
- Public evidence
- The official product material specifies 600 x 600 mm sample capacity, thermal excursions up to 300°C, complete time-temperature history, and use in failure analysis, quality control, material/design selection and FEA validation.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.