PS600S thermal warpage metrology system
Measures out-of-plane deformation through a complete heating and cooling profile, exposing warpage reversal, peak deformation and temperature-dependent behavior that room-temperature inspection can miss.
Akrometrix
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- Thermal warpage · Shadow moire · DIC / strain metrology
Applications: Wafer, panel and package · BGA / package-to-PCB / PoP mating interfaces
Catalog solutions · 2
Interface Analysis for dynamic mating-surface gaps
A BGA package and PCB can each meet a warpage criterion yet leave local gaps when paired at reflow temperature. Comparing both surfaces helps locate regions that may fall outside the contact window.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- PS600T / PS600S thermal warpage measurement platforms · Warpage reversal during cooling in large 2.5D FCBGA packages →
- Temperature-dependent warpage / height-difference evaluation · BGA head-in-pillow open joints →
- Interface Analysis for dynamic mating-surface gaps · BGA head-in-pillow open joints →
- Supported-topography optical measurement evaluation · Fan-out panel warpage during chucking and handling →
- Evaluation of DFP solder-ball heights and package geometry · Package solder-ball coplanarity and initial contact →
Public sources
- Product information: PS600S thermal warpage metrology system
- Technical reference: PS600S technical specifications (PDF)
- Product information: Interface Analysis for dynamic mating-surface gaps
- Technical reference: Implementing Warpage Management: A Five-Step Process for EMS Providers (August 2014) (PDF)
Contact information
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United States · Headquarters · Sales inquiries
Akrometrix
- Phone
- +1 404 486 0880
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