Interface Analysis for dynamic mating-surface gaps
Akrometrix · Warpage, topography and stress metrology
- Purpose
- A BGA package and PCB can each meet a warpage criterion yet leave local gaps when paired at reflow temperature. Comparing both surfaces helps locate regions that may fall outside the contact window.
- Technical approach
- Interface Analysis is an optional Studio software package that pairs two independent mating-surface data sets measured with TherMoiré. It provides 3D/2D gap views, statistics and Pass/Warning/Fail maps using user-defined limits.
- Scope of use
- Akrometrix describes BGA/PCB and PoP interfaces, comparing surface shapes at process temperatures for assembly assessment and troubleshooting. The paired data need consistent temperature, coordinates and alignment definitions.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsResults depend on matched temperatures, coordinate/sign conventions and alignment; user-defined limits need an engineering basis. Gap maps alone do not establish solder wetting, actual joint formation or lifetime.
What to prepareBLNKK suggests preparing package and board topography at matching temperatures, alignment/coordinate definitions, solder ball/paste heights, reflow profiles and failure locations to compare geometric gaps with the contact window.
Confirm with the supplierConfirm current Studio/Interface Analysis licensing, TherMoiré data compatibility, pairing and temperature-interpolation methods, and how acceptance limits are established. Discuss validation using cross-sections, electrical continuity or reflow trials.
- Public evidence
- The current page lists two-surface comparisons, gap gauges and user-defined assessment maps. An August 2014 U.S. Tech article also explains how interface gaps at process temperature can help locate potential interconnect problems.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.