Pyramax with TrueFlat advanced-packaging reflow and warpage control

BTU International · Process equipment and thermal control

Purpose: Control thin-substrate flatness during reflow when warpage may affect die tilt and joint formation.
Technical approach: Uses recipe-controlled suction on the Pyramax platform alongside convection heating and cooling; published configurations include air or nitrogen.
Scope of use: Targets flatness management in thin-substrate and advanced-packaging reflow; confirm substrate, carrier and transport compatibility.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
In-oven flatness does not guarantee post-cooling warpage or joint reliability. TrueFlat suction is not equivalent to vacuum void reduction.
What to prepare
Prepare substrate dimensions/thickness, carriers and die layout, existing profiles, thermal-warpage measurements and joint-quality data for sample trials.
Confirm with the supplier
Confirm size/carrier limits, suction recipes and cooling control, then validate warpage, tilt, joints and throughput with your product.
Public evidence: The official page describes controlled suction, standard carriers and no vacuum pump. The technical-article overview discusses cooling and suction uniformity.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.