Pyramax with TrueFlat advanced-packaging reflow and warpage control
Control thin-substrate flatness during reflow when warpage may affect die tilt and joint formation.
BTU International
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- Reflow and thermal processing for semiconductor packaging
Applications: Flip-chip, 2.5D/3D, WLP and PLP reflow
Catalog solutions · 1
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Contact information
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United States · Headquarters
BTU International, Inc. — Headquarters
- Phone
- +1 978 667 4111
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Taiwan · Supplier office
BTU Taiwan
- Phone
- +886 939 706 794
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Mainland China · Supplier office
BTU Shanghai
- btuasia@btu.com
- Phone
- +86 21 5866 9098
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United States · General contact · Sales inquiries
BTU International — Equipment Sales
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