PIMEL photosensitive polyimide
Asahi Kasei · Material properties and interface engineering
- Purpose
- RDL dielectrics and chip-protection films must balance fine patterning, cured material properties and package stress. This solution focuses on selecting photosensitive-polyimide grades within PIMEL.
- Technical approach
- Photosensitive material forms patterned protective/insulating layers through exposure, development and cure. Include the selected grade’s mechanical and stress-relaxation behavior in stack evaluation.
- Scope of use
- Applications include chip-surface protection, bump passivation and RDL insulation, with series selected for wafer/panel processes. The broader PIMEL lineup also includes PBO/phenolic materials; their attributes are not assigned to these PI grades.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsProcessing, mechanical and dielectric properties differ by series and chemistry. Low-stress/low-temperature claims from another chemistry do not qualify all PI grades, and selected low-warpage grades do not guarantee lower warp in every stack.
What to prepareBLNKK recommends preparing film thickness, line/space or via targets, surface metals, exposure/development/cure flows and thermal budgets. Include material parameters, shrinkage, adhesion and stack-warp data to plan selection and validation.
Confirm with the supplierConfirm exact grade, chemistry, current technical data and sample availability, then check processing, cure and substrate compatibility. Request mechanical/dielectric and qualification test conditions, and the stack/reference behind any low-warpage claim.
- Public evidence
- The official page describes these uses and selected grades developed for large-package warpage and fine patterning. The product site distinguishes chemistries/series, but no exact grade or customer-stack qualification is established here.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.