PIMEL photosensitive polyimide
RDL dielectrics and chip-protection films must balance fine patterning, cured material properties and package stress. This solution focuses on selecting photosensitive-polyimide grades within PIMEL.
Asahi Kasei
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- Photosensitive materials · films · electronic and thermal materials
Applications: RDL / die protection · Fine-pattern packaging lithography
Catalog solutions · 2
Asahi Kasei SUNFORT TA fine-pattern dry film resist
Compare fine-pattern resist processing for package substrates and interposers where circuit separation matters.
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Japan · Headquarters
Asahi Kasei Corp.
- Phone
- +81 3 6699 3000
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