Solstice CopperMax copper RDL plating

ClassOne Technology · Process equipment and thermal control

Purpose: Controls plated RDL thickness and shape uniformity to support process evaluation of overgrowth or bridging.
Technical approach: CopperMax separates additives from the anode using a cation-exchange membrane; flow, electric-field shaping and wafer rotation tune deposition.
Scope of use: For through-resist copper RDL in WLP and 2.5D/3D interconnects, with chemistry/equipment selected for the process.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Uniform deposition does not guarantee elimination of shorts; resist openings, seed and pattern density remain relevant. Savings claims are not project guarantees.
What to prepare
BLNKK suggests RDL/resist patterns, seed, current/bath settings and thickness, bridge and wafer maps.
Confirm with the supplier
Confirm current/flow windows, additive monitoring and maintenance, and sample-level uniformity/short assessment.
Public evidence: ClassOne’s RDL page explains the chamber and additive-protection mechanism. The datasheet marked ©2022 describes the copper-plating system and modular configurations.

Supporting references

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