Solstice CopperMax copper RDL plating
Controls plated RDL thickness and shape uniformity to support process evaluation of overgrowth or bridging.
ClassOne Technology
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- Electroplating and wet processing for compound semiconductor and packaging
Applications: WLP / 2.5D / 3D RDL · WLP / flip-chip metal patterning
Catalog solutions · 2
Solstice Wet Etch UBM/seed-metal isolation
Assess residual-metal removal and electrical isolation after RDL plating and resist stripping.
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Public sources
Contact information
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United States · Headquarters
ClassOne Technology, Inc. — Kalispell Headquarters
- info@ClassOne.com
- Phone
- +1 406 407 7814
Official source ↗Source checked
Taiwan · Supplier-listed distributor · Sales inquiries
Scientech Corporation — ClassOne Taiwan Sales and Support
- Taiwan@ClassOne.com
Official source ↗Source checked
Mainland China · Supplier-listed distributor · Sales inquiries
Scientech Engineering Corp. (Shanghai) — ClassOne Sales and Support
- China@ClassOne.com
- Phone
- +86 21 5820 0880
Official source ↗Source checked
More regional contacts (1)
Germany · Supplier office
ClassOne Technology GmbH — Freilassing
- info@ClassOne.com
- Phone
- +49 151 64 595 002
Official source ↗Source checked
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