Solstice Wet Etch UBM/seed-metal isolation

ClassOne Technology · Process equipment and thermal control

Purpose: Assess residual-metal removal and electrical isolation after RDL plating and resist stripping.
Technical approach: Solstice Wet Etch combines flood-flow chemistry delivery, controlled rotation and endpoint detection for UBM or patterned metals.
Scope of use: ClassOne lists WLP and flip chip; chemistry selection depends on the metal stack, dimensions and selectivity.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Published examples do not guarantee zero undercut or repair every short. Film removal and preservation of circuit dimensions both require validation.
What to prepare
BLNKK suggests preparing seed/barrier layers, thickness, linewidth/spacing, residue locations, available chemistries, and before/after topography and electrical results.
Confirm with the supplier
Confirm selectivity, endpoints and lateral-etch windows, then discuss residue criteria, dimensional loss and post-clean electrical-isolation tests.
Public evidence: The product page describes isolation and the tradeoffs among uniformity, repeatability, undercut and dimensional loss.

Contact the supplier

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