Multilayer ceramic core substrate for advanced HDBU packaging
KYOCERA · Package architecture and warpage compensation
- Purpose
- Large HDBU and chiplet packages need core stiffness and thermal-stress resistance to manage warpage or cracking during build-up, die mounting and thermal processing.
- Technical approach
- A high-modulus, high-strength multilayer ceramic core supports high-density build-up layers. Core stiffness and material-specific CTE govern deformation during heating and assembly.
- Scope of use
- Targets large, multi-die HDBU packages and thinner core designs. KYOCERA supplies the ceramic core; complete build-up-substrate integration remains a separate task.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsThe ceramic core is not a complete build-up substrate or a drop-in replacement. Published warpage comparisons are simulations; product-specific assembly validation is still needed.
What to prepareBring package dimensions, core/build-up stackup, die layout, thermal profiles and warpage targets, with routing, dielectric and mechanical-reliability requirements.
Confirm with the supplierConfirm sample and production supply, materials, dimensions, via/build-up integration and simulation assumptions. Agree on representative fabrication and assembly qualification.
- Public evidence
- The product page publishes representative material properties and assembly-warpage simulations. An April 2026 release announces commercialization and custom-design support; these are not universal performance or volume-production guarantees.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.