Multilayer ceramic core substrate for advanced HDBU packaging
Large HDBU and chiplet packages need core stiffness and thermal-stress resistance to manage warpage or cracking during build-up, die mounting and thermal processing.
Kyocera
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- Ceramic packages · substrates · metallization and thermal solutions
Other names: KYOCERA
Applications: Large HDBU and chiplet package substrates · Optical-source thermal/drift preparation · RF package-port/transition comparison
Catalog solutions · 3
Kyocera thin-film laser-diode submounts
Optical-source thermal-drift assessment needs repeatable laser mounting and cooling for a temperature baseline.
Kyocera high-frequency coaxial-feedthrough packages
RF insertion-loss assessment needs consistent device-to-package-port transitions.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Multilayer ceramic core substrate for advanced HDBU packaging · Warpage reversal during cooling in large 2.5D FCBGA packages →
- Kyocera thin-film laser-diode submounts · Temperature-dependent optical coupling drift in CPO →
- Kyocera high-frequency coaxial-feedthrough packages · RF package transitions and insertion loss →
Public sources
Contact information
Contact the supplier directly through its official channels.
For ceramic-package inquiries, select “Ceramic Packages” in the form; for organic package substrates, select “Organic Packages”. Official source ↗
Taiwan · Supplier office · Sales inquiries
KYOCERA Asia Pacific Pte. Ltd. — Taipei Branch / Semiconductor Components Sales
- Phone
- +886 2 2567 2008
Official source ↗Source checked
Singapore · Headquarters · Sales inquiries
KYOCERA Asia Pacific Pte. Ltd. — Head Office / Semiconductor Components Sales
- Phone
- +65 6271 0500
Official source ↗Source checked
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