Kyocera high-frequency coaxial-feedthrough packages

Kyocera · Package architecture and warpage compensation

Purpose: RF insertion-loss assessment needs consistent device-to-package-port transitions.
Technical approach: Kyocera combines a metal package, ceramic coaxial feedthrough and bottom-brazed CuMo heat spreader.
Scope of use: The stated coaxial scope includes RF/millimeter-wave and MMIC devices; confirm band, launch geometry and thermal constraints.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Do not transfer surface-mount, waveguide or RF-KLCC configurations. Verify actual loss; this is not an organic-package drop-in replacement or EMC guarantee.
What to prepare
BLNKK suggests band, impedance, launch/return, device/package/board interfaces, deembedding and enclosure/thermal records.
Confirm with the supplier
Confirm geometry, materials/connectors, frequency/S-parameter data, reference planes/test methods and design compatibility.
Public evidence: The named coaxial section describes qualitative low-loss transitions and the ceramic/CuMo structure.

Contact the supplier

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