Apollo vertical probe cards

FormFactor · Reliability qualification and failure analysis

Purpose: Copper-pillar and bump testing must control contact conditions and loading. Apollo vertical probe cards are candidates for evaluating wafer-test contact interfaces.
Technical approach: Vertical wire or MEMS probes and space transformers contact wafer pads/bumps. Match probe, current and force options to geometry and test needs.
Scope of use: Named applications include copper pillars, solder bumps, flip-chip/pre-bump pads and area-array/perimeter layouts. Requires compatible test and wafer-probing equipment.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Published options are not one simultaneous specification. Valid contact does not establish defect-free dies or identify internal failure causes.
What to prepare
BLNKK recommends preparing pad/bump maps, metals/pitch, current, temperature and test programs. Include planarity, overtravel, contact resistance and probe-mark references.
Confirm with the supplier
Confirm probe/transformer configuration, force/current/temperature windows and tester/prober compatibility. Discuss cleaning, lifetime and acceptable marks before subsequent bonding.
Public evidence: The product page documents Apollo applications and probe, pitch, low-force and current options. The brochure download could not be read.

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