Apollo vertical probe cards
Copper-pillar and bump testing must control contact conditions and loading. Apollo vertical probe cards are candidates for evaluating wafer-test contact interfaces.
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View contact information ↓Applications: Copper pillars / flip-chip bumps · Wafer TSV isolation test structures · Interposer/RF coupon ports
Copper-pillar and bump testing must control contact conditions and loading. Apollo vertical probe cards are candidates for evaluating wafer-test contact interfaces.
Separate TSV leakage from contact, fixture and environmental background currents.
Interposer crosstalk comparisons must separate device coupling from probes and fixtures.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
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United States · Headquarters
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Mainland China · Supplier-listed distributor · Sales inquiries
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