EVOLVITY 300 contact/environment platform for TSV leakage measurements

FormFactor · Geometric and electrical metrology

Purpose: Separate TSV leakage from contact, fixture and environmental background currents.
Technical approach: EVOLVITY 300 provides semi-automated wafer probing/configuration with external RF/DC measurement instruments.
Scope of use: Supplier-positioned 300 mm wafer characterization; proposed TSV use needs accessible, independently biased test pads.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
The station is not a complete low-current instrument. RF/DC use does not establish TSV leakage sensitivity, and current alone does not localize buried liner defects.
What to prepare
BLNKK suggests preparing pads, bias/current ranges, instruments, guarding, temperature/humidity, background and settling times.
Confirm with the supplier
Confirm contact, shielding/guarding, thermal configuration and instrument integration; use blank/reference structures to verify measurement floor, stability and repeatability.
Public evidence: The April 8, 2025 release documents semi-automated RF/DC characterization and measurement-assistant compatibility.

Supporting references

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