LTC 9300 low-temperature-cure RDL polyimide
FUJIFILM Electronic Materials · Material properties and interface engineering
- Purpose
- RDL dielectrics must balance patterning, curing budget and material properties. LTC 9300 offers low-temperature-curable photosensitive polyimides for material selection.
- Technical approach
- Negative-tone PI precursors form patterned dielectric layers through exposure, solvent development and curing. Film thickness and processing depend on grade.
- Scope of use
- Targets advanced-packaging RDL. E07, E19 and E76B have separate data; E76B lists LDI capability that is not assigned across the series.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCure ranges, film thickness and exposure methods vary by grade; typical properties depend on curing. NMP-free does not mean solvent-free development or guaranteed warpage/open prevention.
What to prepareBLNKK recommends preparing grade, film/metal stack, pattern/vias and exposure/development/thermal history. Include material, adhesion, moisture and thermal-cycle continuity data for validation planning.
Confirm with the supplierConfirm current grade, thickness/lithography windows, developer/rinse and cure time/atmosphere. Request properties and reliability conditions for the selected cure, plus sample availability.
- Public evidence
- The page and three technical sheets marked ©2023 document grades, processing windows and cure-dependent typical properties. They do not qualify customer-stack warpage or continuity.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.