LTC 9300 low-temperature-cure RDL polyimide
RDL dielectrics must balance patterning, curing budget and material properties. LTC 9300 offers low-temperature-curable photosensitive polyimides for material selection.
FUJIFILM Electronic Materials
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- Photoresists · polyimides · cleaners and advanced packaging materials
Applications: Advanced-packaging RDL · Copper/dielectric hybrid-bonding surfaces · Copper post-CMP surface-cleaning comparison
Catalog solutions · 3
PSL2300C CMP slurry for copper hybrid bonding
Hybrid-bonding surfaces require controlled copper recess and dielectric profiles when comparing CMP conditions.
FUJIFILM Clean-100 copper post-CMP cleaner
Prebond assessment needs residue-removal and copper-surface comparisons after CMP.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- PSL2300C CMP slurry for copper hybrid bonding · Local interface voids after hybrid bonding →
- LTC 9300 low-temperature-cure RDL polyimide · Cracking and intermittent opens in fine-line RDL after thermal cycling →
- FUJIFILM Clean-100 copper post-CMP cleaner · Pre-bond surface readiness and release for hybrid bonding →
Public sources
Contact information
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Taiwan · Supplier office
FUJIFILM Electronic Materials Taiwan Co., Ltd.
- Phone
- +886 3 597 7674
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Singapore · Supplier office
FUJIFILM Electronic Materials (Singapore) Pte. Ltd.
- Phone
- +65 6887 5380
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Japan · Supplier office · Sales inquiries
FUJIFILM Corporation — Electronic Materials Business Division
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