PSL2300C CMP slurry for copper hybrid bonding

FUJIFILM Electronic Materials · Materials and interface control

Purpose: Hybrid-bonding surfaces require controlled copper recess and dielectric profiles when comparing CMP conditions.
Technical approach: PSL2300C provides adjustable barrier-metal/ILD removal, selectivity and copper-recess control through chemical mechanical polishing.
Scope of use: Supplier-listed copper hybrid-bonding polish, assessed against actual films, pattern density, pads and equipment.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Slurry is neither metrology nor a repair for bonded voids. Polishing performance alone does not qualify cleanliness, activation or subsequent bonding.
What to prepare
BLNKK suggests documenting films, recess/profile targets, pattern density, pads and existing recipes, with before/after measurements and defect maps.
Confirm with the supplier
Confirm applicable formulations, removal/selectivity windows, corrosion/defect data, and integration with the actual post-cleaning and bonding flow.
Public evidence: The named product entry describes recess and surface-profile control. A September 2025 release provides copper/oxide hybrid-bonding CMP context without naming this grade.

Supporting references

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