FUJIFILM Clean-100 copper post-CMP cleaner
FUJIFILM Electronic Materials · Material properties and interface engineering
- Purpose
- Prebond assessment needs residue-removal and copper-surface comparisons after CMP.
- Technical approach
- Clean-100 is an acidic copper post-CMP cleaner for particles and organic residues.
- Scope of use
- A candidate for copper post-CMP cleaning; validate actual copper/dielectric stacks and subsequent bonding.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsGeneral copper-CMP use does not establish hybrid-bond qualification. Low etch rate is not zero copper loss; cleaning does not repair existing bond voids or topography errors.
What to prepareBLNKK suggests documenting stacks/residues, cleaning/rinsing/drying conditions, and copper-loss, roughness and residue checks.
Confirm with the supplierConfirm compatibility, concentration/time, copper-surface effects and storage, and agree cleanliness and release verification for subsequent bonding.
- Public evidence
- The named lineup lists acidic chemistry, low copper static-etch rate and residue cleaning, without quantified conditions.
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Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.