FineSAT III acoustic package inspection
Hitachi High-Tech · Warpage, topography and stress metrology
- Purpose
- Internal package voids, cracks or interface separation may be invisible externally. Acoustic signals from the target layer can help narrow the area for follow-up analysis.
- Technical approach
- FineSAT III scans ultrasonic reflection and transmission signals with waveform, phase, intensity and depth analysis. Multiple gates select time/depth regions for comparing interface signals.
- Scope of use
- Hitachi lists semiconductor packages, electronic components, ceramics, metals and resins for R&D and production inspection. Probe frequency/focal length and water coupling need selection for the actual stack and target interface.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsDetectability depends on probes, attenuation, reflection shadowing and gates. The manufacturer’s nanometer-gap detection statement is not nanometer spatial resolution. Coupling, local immersion and 3D options need configuration confirmation and specimen validation.
What to prepareBLNKK suggests preparing stack-up, dimensions/target interfaces, water-contact acceptability, expected defects and good/bad references, plus probe/frequency, gate settings and cross-section or complementary results.
Confirm with the supplierConfirm the FineSAT III submodel, probes/coupling options, target-layer visibility and gate/image criteria. Confirm whether volume scan/3D viewer is needed, along with specimen fixtures and post-immersion handling.
- Public evidence
- The FineSAT III page lists simultaneous reflection/transmission measurement, up to 64 gates, all-point waveforms and offline gate adjustment/image redraw. Volume scan and 3D viewer are options; local-immersion configuration also needs confirmation.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.