FineSAT III acoustic package inspection
Internal package voids, cracks or interface separation may be invisible externally. Acoustic signals from the target layer can help narrow the area for follow-up analysis.
Hitachi High-Tech
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View contact information ↓Public capability summary
- Electron microscopy · defect review · semiconductor metrology
Applications: Packages / electronic components · Substrate microvias and multilayer interfaces · Die sidewalls and exposed RDL · Board / adhesive material coupons · Board and package material coupons
Catalog solutions · 5
IM4000II substrate-interconnect ion-milled cross sections
Prepare cross-sectional evidence of metal/polymer interfaces after locating a substrate-microvia anomaly.
SU5000 diced-sidewall and exposed-surface SEM imaging
Examine diced-sidewall residue and damage morphology for process and anomaly comparisons.
NEXTA DMA200 material viscoelastic characterization
Obtain temperature/frequency-dependent viscoelastic data for board/adhesive thermomechanical assessment.
TMA7100 / TMA7300 material thermal expansion
Obtain material expansion/shrinkage inputs for board/package thermal-fatigue assessment.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- FineSAT III acoustic package inspection · Underfill voids and post-cure delamination in large multi-die packages →
- IM4000II substrate-interconnect ion-milled cross sections · Intermittent opens in stacked substrate microvias after reflow →
- NEXTA DMA200 material viscoelastic characterization · Board-level BGA solder-joint fatigue under thermal cycling →
- TMA7100 / TMA7300 material thermal expansion · Board-level BGA solder-joint fatigue under thermal cycling →
- SU5000 diced-sidewall and exposed-surface SEM imaging · Sidewall residue and cleaning after plasma dicing →
Public sources
- Product information: FineSAT III acoustic package inspection
- Product information: IM4000II substrate-interconnect ion-milled cross sections
- Product information: SU5000 diced-sidewall and exposed-surface SEM imaging
- Product information: NEXTA DMA200 material viscoelastic characterization
- Product information: TMA7100 / TMA7300 material thermal expansion
Contact information
Contact the supplier directly through its official channels.
This form is handled by Hitachi High-Tech America and includes country/region and product fields. For Taiwan inquiries, open the Taiwan Contact Us page and select Semiconductor Manufacturing Equipment or General Inquiry. Opening the Taiwan form directly may be blocked by its referrer check. Official source ↗
United States · Headquarters
Hitachi High-Tech America, Inc. — Headquarters; Metrology and Analysis Systems
- Phone
- +1 847 273 4141
Official source ↗Source checked
Taiwan · Supplier office
Hitachi High-Tech Taiwan Corporation — Taipei Office
- Phone
- +886 2 2563 4750
Official source ↗Source checked
Taiwan · Supplier office
Hitachi High-Tech Taiwan Corporation — Hsinchu Office (NCT)
- Phone
- +886 3 560 1366
Official source ↗Source checked
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