TMA7100 / TMA7300 material thermal expansion
Hitachi High-Tech · Engineering metrology and failure analysis
- Purpose
- Obtain material expansion/shrinkage inputs for board/package thermal-fatigue assessment.
- Technical approach
- TMA7100/TMA7300 measure dimensional changes with time/temperature under selected probes and loads.
- Scope of use
- Evaluate compatible coupons with model/probe selection matched to temperature range and orientation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCoupon results do not measure assembled-BGA cycling life or solder fatigue. Model ranges, probes and accessories are not interchangeable.
What to prepareBLNKK suggests preparing materials/layers, dimensions/orientation, cure/moisture, loads, ramps and thermal histories with control coupons.
Confirm with the supplierConfirm model/probes, temperature coverage, dimensional/temperature calibration and separation of expansion, shrinkage and other deformation.
- Public evidence
- The named product page explains measurement and distinguishes model configurations.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.