Flip Chip PKG high-density IC substrates

Ibiden · Package architecture and warpage compensation

Purpose: High-I/O chip designs need fine substrate routing and interlayer microvias. Compare this substrate option when planning package interconnects.
Technical approach: Combines semi-additive conductor patterning with alignment, laser and metallization technologies for microvias.
Scope of use: Flip-chip IC substrates for PC/data-center processors and AI or automotive semiconductors, as listed by Ibiden.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Public capability does not establish package qualification or guarantee lower warpage; interface concerns still need specimen-level comparison.
What to prepare
BLNKK suggests I/O and dimensions, layer count/stackup, microvia geometry, failure locations, thermal history and a warpage budget.
Confirm with the supplier
Confirm design rules, microvia-interface and plating data, relevant reliability coupons, production conditions and availability.
Public evidence: The product page describes wiring and microvia technologies and applications, without project-specific qualification results.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.