Flip Chip PKG high-density IC substrates
High-I/O chip designs need fine substrate routing and interlayer microvias. Compare this substrate option when planning package interconnects.
Ibiden
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- High-density IC package substrates for HPC and advanced packaging
Applications: Flip-chip / high-density substrates
Catalog solutions · 1
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This product inquiry form covers Flip Chip Package estimates, technical questions and sales/service inquiries. The Taiwan office handles electronics substrate sales. Official source ↗
United States · Supplier office · Sales inquiries
IBIDEN U.S.A. Corp. — San Jose; Product Sales
- Phone
- +1 408 207 9601
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
IBIDEN Taiwan Co., Ltd. — Electronics Substrate Sales
- Phone
- +886 7 550 8599
Official source ↗Source checked
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