JSM-IT810 SEM / EDS cross-section analysis
JEOL · Reliability qualification and failure analysis
- Purpose
- Located package-contact cross-sections need morphology and elemental analysis to complement electrical measurements and investigate interfaces.
- Technical approach
- Combines FE-SEM imaging with EDS; Neo Action automates selected-area observation and analysis under specified conditions.
- Scope of use
- Prepared IC, bonding or material cross-sections, subject to preparation quality and detector configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCross-section preparation alters the specimen; this is not intact-package non-destructive inspection. EDS does not directly determine contact resistance or bond strength.
What to prepareBLNKK suggests failure locations, contact structures/electrical results, target elements, sacrificial samples and preparation records.
Confirm with the supplierConfirm section targeting/preparation, EDS detection/quantification conditions, detectors and automation/calibration configuration.
- Public evidence
- JEOL’s May 30, 2025 presentation shows IC bonding-section imaging and elemental analysis after cross-section polishing.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.