JSM-IT810 SEM / EDS cross-section analysis
Located package-contact cross-sections need morphology and elemental analysis to complement electrical measurements and investigate interfaces.
JEOL
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View contact information ↓Public capability summary
- Electron microscopy · surface and cross-section analysis
Applications: IC / bonding cross-sections · Vacuum-compatible residue surfaces · Microbump and interface failure specimens · Solder / IMC interface lamellae · Solder and metal-interface cross sections
Catalog solutions · 5
JPS-9030 XPS surface-chemistry analysis
Compare surface elements and chemical states before/after cleaning to narrow residue and process hypotheses.
JIB-PS500i site-specific FIB sampling
Prepare local sections/lamellae from prelocalized suspected open contacts for interface investigation.
JEM-F200 IMC lamella microstructure analysis
Local microstructure and elemental distributions can add evidence when investigating fracture near an intermetallic compound (IMC) interface.
JXA-iHP200F WDS analysis of joint cross sections
Compare elemental composition at selected solder-fracture cross-section locations against cracks and unaffected regions.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- JIB-PS500i site-specific FIB sampling · Non-wetting, cold joints and opens in HBM thermocompression bonding →
- JSM-IT810 SEM / EDS cross-section analysis · High initial RDL via contact resistance →
- JPS-9030 XPS surface-chemistry analysis · Temporary-bond residue and cleaning compatibility →
- JEM-F200 IMC lamella microstructure analysis · Brittle fracture at solder IMC interfaces →
- JXA-iHP200F WDS analysis of joint cross sections · Brittle fracture at solder IMC interfaces →
Public sources
- Product information: JSM-IT810 SEM / EDS cross-section analysis
- Technical reference: Financial Results Briefing, May 30, 2025 — IC cross-section analysis (page 32) (PDF)
- Product information: JPS-9030 XPS surface-chemistry analysis
- Product information: JIB-PS500i site-specific FIB sampling
- Product information: JEM-F200 IMC lamella microstructure analysis
- Product information: JXA-iHP200F WDS analysis of joint cross sections
Contact information
Contact the supplier directly through its official channels.
United States · Supplier office · Sales inquiries
JEOL USA, Inc. — Sales / Peabody
- salesinfo@jeol.com
- Phone
- +1 978 535 5900
Official source ↗Source checked
Taiwan · Supplier office
JEOL TAIWAN ANALYSIS SOLUTIONS LTD.
- Phone
- +886 3 571 5106
Official source ↗Source checked
Mainland China · Supplier office
JEOL (BEIJING) CO., LTD.
- Phone
- +86 10 6804 6321
Official source ↗Source checked
More regional contacts (1)
Taiwan · Supplier office
JEOL TAIWAN SEMICONDUCTORS LTD.
- Phone
- +886 3 571 5656
Official source ↗Source checked
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