JEM-F200 IMC lamella microstructure analysis

JEOL · Engineering metrology and failure analysis

Purpose: Local microstructure and elemental distributions can add evidence when investigating fracture near an intermetallic compound (IMC) interface.
Technical approach: JEM-F200 uses TEM/STEM to examine thin specimens; an optional EDS configuration adds elemental analysis and mapping.
Scope of use: For prepared electron-transparent specimens. Confirm sampling position, preparation and analytical configuration for the IMC interface.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
A lamella represents only the sampled region. Preparation and beam effects matter; elemental maps alone do not establish fracture mechanism, joint strength or lifetime.
What to prepare
BLNKK suggests preparing fracture coordinates, interface stack, specimen-preparation records and target elements, with electrical, cross-section and process evidence.
Confirm with the supplier
Confirm specimen/holder suitability, analytical options and conditions, and how preparation or beam-induced changes will be assessed.
Public evidence: JEOL describes TEM/STEM, optional EDS, FIB-lamella transfer and semiconductor-device analysis examples.

Contact the supplier

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