DAGE 4600 automated bond-strength testing
Nordson Test & Inspection · Reliability qualification and failure analysis
- Purpose
- Measures mechanical strength and failure modes of wire, bump, die and surface-mount bonds, with automation supporting consistent, traceable batch data.
- Technical approach
- Runs programmed alignment, pull and shear tests and records force and failure images. Wafer/strip loading, identification and factory communications depend on configuration.
- Scope of use
- Supports production sampling, engineering validation and process comparisons for package and wafer-level interconnects. Listed applications include sub-50 µm pillars/bumps, BGA, substrates and composite wafers.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsLocal bond strength does not establish whole-package life. Destructive tests consume samples; confirm whether proof-load or nondestructive modes suit the bond and acceptance method.
What to prepareBring bond dimensions, materials, sample images, acceptable damage, test standards and a sampling plan, plus failure-classification and traceability needs.
Confirm with the supplierConfirm cartridge, tool geometry, force range, loading direction/speed and fixture/handling compatibility. Ask about repeatability, failure classification and factory-interface options.
- Public evidence
- Official specifications list pull, shear and cold-bump-pull options, a platform force range of 0.01 gf–50 kgf, failure imaging and automated handling/traceability. Actual ranges and features depend on cartridges and configuration.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.