DAGE 4600 automated bond-strength testing
Measures mechanical strength and failure modes of wire, bump, die and surface-mount bonds, with automation supporting consistent, traceable batch data.
Nordson Test & Inspection
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View contact information ↓Public capability summary
- X-ray · acoustic microscopy · bond and materials testing
Other names: Nordson TEST & INSPECTION
Applications: Wafer-level interconnect, BGA, substrates and advanced packages · 2.5D/3D IC, fan-out and power packages · Local BGA joint / pad / substrate comparisons · Package metal contacts · Visible package / contact surfaces
Catalog solutions · 5
C-SAM acoustic microscopy for internal package inspection
Inspect internal delamination, cracks, voids and bond anomalies to guide further package analysis.
BT 4000HS high-speed joint-shear comparison
Brittle joints and pad/substrate failures need comparison under controlled high-speed shear.
Quadra 7 Pro contact X-ray inspection
X-ray imaging can locate internal metal geometry that needs further investigation when solder bridging is suspected.
SQ3000S visible-contact and package coplanarity
Comparing visible terminal height and package coplanarity requires a consistent reference plane and repeatable optical measurements.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- C-SAM scanning acoustic microscopy platform · Local interface voids after hybrid bonding →
- D9650Z power-module acoustic inspection system · Rising thermal resistance during power cycling →
- C-SAM microelectronic interface inspection · Underfill voids and post-cure delamination in large multi-die packages →
- SQ3000S visible-contact and package coplanarity · Package solder-ball coplanarity and initial contact →
- Assess controlled shear / pull modes · Brittle fracture at solder IMC interfaces →
- BT 4000HS high-speed joint-shear comparison · Brittle fracture at solder IMC interfaces →
- DAGE 4600 automated bond-strength testing · Brittle fracture at solder IMC interfaces →
- Assess relative pad / bump pull and shear comparisons · BGA drop-induced pad cratering →
- BT 4000HS high-speed joint-shear comparison · BGA drop-induced pad cratering →
- Quadra 7 Pro contact X-ray inspection · Solder bridging after flip-chip reflow →
- Wire pull / shear configuration and fracture-mode comparison · Power wire-bond lift-off and heel fatigue →
Public sources
- Product information: DAGE 4600 automated bond-strength testing
- Technical reference: Updated 4600 Series Brochure
- Product information: C-SAM acoustic microscopy for internal package inspection
- Technical reference: D9650Z C-SAM C-mode scanning acoustic microscope
- Product information: BT 4000HS high-speed joint-shear comparison
- Product information: Quadra 7 Pro contact X-ray inspection
- Product information: SQ3000S visible-contact and package coplanarity
Contact information
Contact the supplier directly through its official channels.
The listed regional contacts handle Bondtest sales. For acoustic, X-ray or optical inspection products, select the appropriate product line in the official inquiry form. Official source ↗
United States · Supplier office · Sales inquiries
Nordson Test & Inspection Americas — Bondtest Sales
- Phone
- +1 760 918 8471
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Nordson Advanced Technology LLC, Taiwan Branch — Bondtest Sales
- Phone
- +886 978 172 053
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
Suzhou Nordson Electronics Equipment Co. Ltd. — Bondtest Sales
- Phone
- +86 512 6665 2008
Official source ↗Source checked
More regional contacts (1)
South Korea · Supplier office · Sales inquiries
Nordson Test & Inspection Korea — Bondtest Sales
- jake.kim@nordson.com
- Phone
- +82 31 462 9642
Official source ↗Source checked
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