C-SAM acoustic microscopy for internal package inspection

Nordson TEST & INSPECTION · Warpage, topography and stress metrology

Purpose: Inspect internal delamination, cracks, voids and bond anomalies to guide further package analysis.
Technical approach: Uses ultrasound scanning and echo analysis for depth/interface images; frequency, scan direction and coupling depend on configuration.
Scope of use: For microelectronics development, screening, process checks and failure analysis, using application-specific systems and fixtures.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Materials, thickness and geometry affect access and detection. Nondestructive inspection does not eliminate water-contact or coupling-compatibility concerns.
What to prepare
Prepare stack details, target interfaces, suspected defects and known-defect samples, water-contact constraints and screening/line requirements.
Confirm with the supplier
Confirm system, frequency, scan/coupling method, detection/false calls, repeatability, drying and cross-validation.
Public evidence: The official AMI overview covers laboratory and production inspection. The D9650Z datasheet illustrates power-module bond, void and thickness inspection.

Supporting references

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