Quadra 7 Pro contact X-ray inspection

Nordson Test & Inspection · Engineering metrology and failure analysis

Purpose: X-ray imaging can locate internal metal geometry that needs further investigation when solder bridging is suspected.
Technical approach: Quadra 7 Pro combines a dual-mode X-ray tube, Onyx detector and Revalution software for imaging and measurement.
Scope of use: Published for manual 2D/3D back-end semiconductor inspection. Confirm sample penetration, overlapping structures and the required 3D configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Projection overlap, thickness and viewing direction affect interpretation. Validate visibility on real samples; an image alone does not prove conductivity or zero missed defects.
What to prepare
BLNKK suggests preparing suspected-short coordinates, package stack/thickness, electrical results and target defects, with a plan for multiple viewing angles.
Confirm with the supplier
Confirm imaging modes, 3D configuration, fixtures, achievable sample-specific visibility and measurement/data-export functions.
Public evidence: Nordson describes the named tube, detector, high-resolution/high-flux modes and software measurement functions.

Contact the supplier

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