ELPAC WPR photo-imageable dielectric

JSR · Material properties and interface engineering

Purpose: RDL insulation needs a patternable dielectric compatible with via-opening and interface processes. WPR is a material option for comparison.
Technical approach: Uses WPR photosensitive dielectric material for patterned insulation, with exposure, development and cure conditions confirmed per grade.
Scope of use: WL-CSP/SiP redistribution and semiconductor organic passivation; grade, film thickness and stackup need confirmation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Other developmental series appear in the same material; their specifications are not WPR specifications. Dielectric selection alone does not resolve contact resistance or guarantee reduced warpage.
What to prepare
BLNKK suggests film/via geometry, metals/interfaces, exposure/development flow, thermal budget and resistance-failure records.
Confirm with the supplier
Confirm WPR grade, development/cure conditions, residue and adhesion evaluation, material data, availability and process qualification.
Public evidence: JSR’s May 2025 PID panel identifies WPR; its current application page describes redistribution, photo-imageable insulation and passivation.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.