ELPAC WPR photo-imageable dielectric
RDL insulation needs a patternable dielectric compatible with via-opening and interface processes. WPR is a material option for comparison.
JSR
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- Lithography, dielectric and semiconductor packaging materials
Applications: WLCSP / SiP redistribution · WLCSP / SiP copper RDL plating · Upstream prebond CMP-residue cleaning comparison · Prebond polishing-material/topography comparison
Catalog solutions · 4
THB-111N negative-tone resist for copper RDL plating
Assess copper-RDL plating openings and stripping quality when investigating process-related shorts.
JSR post-CMP cleaning solutions
Compare post-CMP cleaning conditions as upstream control of prebond surface residues.
JSR CMP polishing slurries
Compare prebond CMP materials for metal/dielectric removal and topography control.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- JSR CMP polishing slurries · Local interface voids after hybrid bonding →
- THB-111N negative-tone resist for copper RDL plating · RDL line-to-line shorts after fabrication →
- ELPAC WPR photo-imageable dielectric · High initial RDL via contact resistance →
- JSR post-CMP cleaning solutions · Pre-bond surface readiness and release for hybrid bonding →
Public sources
Contact information
Contact the supplier directly through its official channels.
United States · Supplier office
JSR Micro, Inc. — Semiconductor Materials
- Phone
- +1 408 543 8800
Official source ↗Source checked
Taiwan · Supplier office
JSR Electronic Materials Taiwan Co., Ltd.
- Phone
- +886 3 657 6600
Official source ↗Source checked
Mainland China · Supplier office
JSR Electronic Materials (Shanghai) Co., Ltd.
- Phone
- +86 21 6278 7600
Official source ↗Source checked
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