JSR CMP polishing slurries

JSR · Process equipment and thermal control

Purpose: Compare prebond CMP materials for metal/dielectric removal and topography control.
Technical approach: Abrasive slurry formulations provide chemical-mechanical polishing with layer-selective removal.
Scope of use: JSR documents CMP slurry families; confirm the actual grade and stack compatibility.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
General CMP capability does not qualify a hybrid-bond surface or repair existing bond voids; assess topography, roughness and residues.
What to prepare
BLNKK suggests preparing stack/target topography, pad/process conditions and matched pre/post-CMP and post-clean measurements.
Confirm with the supplier
Confirm grade, selectivity, dishing/erosion control, polishing/cleaning compatibility, samples and technical data.
Public evidence: The page describes selectivity, dispersion and removal-rate control, without a named Cu-hybrid-bonding grade.

Contact the supplier

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