THB-111N negative-tone resist for copper RDL plating
JSR · Material properties and interface engineering
- Purpose
- Assess copper-RDL plating openings and stripping quality when investigating process-related shorts.
- Technical approach
- Acrylate groups in negative-tone THB resist cross-link on exposure; TMAH development forms plating openings.
- Scope of use
- THB-111N is listed for copper-plated RDL in WLCSP/SiP, with a model-specific 5–15 µm thickness range.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsThis is not a permanent dielectric or a short-free guarantee. The family 5–90 µm range and other grades’ bumping applications do not apply to THB-111N.
What to prepareBLNKK suggests preparing thickness, linewidth/spacing, exposure and development settings, scum images, seed-layer details, plating chemistry and stripping results.
Confirm with the supplierConfirm process windows, bath and substrate compatibility, opening profiles and stripping conditions; discuss how to distinguish resist residue from other short mechanisms.
- Public evidence
- JSR Micro distinguishes THB-111N copper wiring from other THB grades and bumping applications.
Contact the supplier
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.